Zalman STC8 Thermal Paste, 1.5g Premium CPU Thermal Compound for All Processors, Heatsink, IC, Computer Processor, Cooler, GPU, Superconducting High Viscosity, 8.3 W/m-k, 350-480 Pa.s (ZM-STC8)




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Size: STC 8
Features
- EXCELLENT STABILITY: STC 8 thermal conductivity allows heat from CPU or any computer chips to cool down and very safe as there is no electrical conductivity: 8.3 W/m-k.
- MEASURING GRADUATION: Scale marking on the syringe allows accurate and visual measurement of the content while using or reusing the product.
- OPTIMAL VISCOSITY: Particle size technology provides optimal filler density to conveniently use on any type of computer chips. 350-480 Pa.s.
- EASY TO USE AND STORE: Syringe style is easy to use and rubber-cap prevents liquid content from being hardened over a period of time if reusing is needed
- OUTSTANDING DURABILITY: Fine micro particles fill up space between the heatsink and CPU to maximize cooling performance & RoHS Certified
Description
Model: ZM-STC8 Dimensions (Syringe): 66(W) x 19 (L) x 12(H) mm Volume/Net Weight: 1.5g Color: Gray Thermal Conductivity: 8.3 W/m·K Viscosity: 350 ~ 480 Pa.s Operation Temperature: -40 ~ 200 ℃ Materials: Silicone Dioxide, Aluminum Oxide, Zinc Oxide
Product Dimensions: 0.75 x 0.47 x 2.6 inches
Item Weight: 0.1 ounces
Manufacturer: Zalman Tech Co., Ltd
Country of Origin: China
Item model number: ZM-STC8
Date First Available: January 30, 2020
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