Thermalright intel12th 13th generation LGA1700 anti-bending buckle,curved pressure plate,CPU fixing buckle,CPU stress bending correction fixer, fully fitted and fixed without trace installation (gray)









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Color: GRAY
Features
- [Specification] 54x70x6mm, all aluminum alloy material, main body 20g, overall 55g, with L-shaped screwdriver and TF7 2g, gray
- [Advanced Technology] A fixed aligner developed for the situation where the Intel 12th generation CPU will bend. All-aluminum alloy anode process, CNC-made anode sandblasting, perfectly avoiding capacitors, giving you the ultimate installation experience.
- [Insulation foot pads] The same specifications as the original LOTES insulation protection foot pads are used. Multiple installations will not wear out the CPU cover.
- Easy to InstallWith a L-shaped screwdriver, watch the video operation, and the installation is successful in one step.
- Support SpecificationsIntel 12th generation CPU, motherboard CPU slot for LGA1700 chipset for H610, B660, Z690 series
Product Dimensions: 2.76"L x 2.13"W x 0.24"H
Brand: Thermalright
Compatible Devices: Desktop
Noise Level: 14 dB
Material: Metal
Product Dimensions: 2.76 x 0.24 x 2.13 inches
Item Weight: 2.08 ounces
Manufacturer: Thermalright
Country of Origin: China
Item model number: LGA 1700 BCF
Date First Available: August 16, 2022
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